The Fujitsu MB81ES653225 is a Single Data Rate Interface Fast Cycle Random Access Memory (FCRAM*) containing 67,108,864 memory cells accessible in a 32-bit format. The MB81ES653225 features a fully synchronous operation referenced to a positive edge clock whereby all operations are synchronized at a clock input which enables high performance and simple user interface coexistence.
The MB81ES653225 is utilized using a Fujitsu advanced FCRAM core technology and designed for low power consumption and low voltage operation than regular synchronous DRAM (SDRAM) .
The MB81ES653225 is dedicated for SiP (System in a package) , and ideally suited for various embedded/ consumer applications including digital AVs and image processing where a large band width and low power consumption memory is needed.
* : FCRAM is a trademark of Fujitsu Limited, Japan.
| Parameter | Symbol | Rating | Unit | |
| Min. | Max. | |||
| Supply Voltage Relative to VSS | VDD, VDDQ | − 0.5 | + 3.0 | V |
| Voltage at Any Pin Relative to VSS | VIN, VOUT | − 0.5 | + 3.0 | V |
| Short Circuit Output Current | IOUT | − 50 | + 50 | mA |
| Power Dissipation | PD | — | 1.0 | W |
| Storage Temperature | TSTG | − 55 | + 125 | °C |
• 1 M word × 32 bit × 2 banks organization
• Low power supply
- VDD : + 1.8 V ± 0.15 V
- VDDQ : + 1.8 V ± 0.15 V
• 1.8 V-CMOS I/O interface
• 8 K refresh cycles every 32 ms
• Auto-and Self-refresh
• Two banks operation
• Burst read/write operation and burst read/single write operation capability
• Programmable burst type, burst length, and CAS Latency
• Programmable page length function
• Programmable Partial Array Self Refresh (PASR)
• Programmable Temperature Compensated Self Refresh (TCSR)
• Deep power down mode
• Extended temperature operation
- MB81ES653225-12 : From 0 °C to +85 °C (Ta)
- MB81ES653225-12L : From −25 °C to +85 °C (Ta)
• CKE power down mode
• Output enable and input data mask
• Disable function for TEST
• Self burnin function for TEST
• Built In Self Test (BIST) function for TEST
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MB80101BAN