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Part Number: MBM29DL32XTD

 

 

 

 

Description: The MBM29DL32XTD/BD are a 32M-bit, 3.0 V-only Flash memory organized as 4M bytes of 8 bits each or 2M ...


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MBM29DL32XTD General Description


The MBM29DL32XTD/BD are a 32M-bit, 3.0 V-only Flash memory organized as 4M bytes of 8 bits each or 2M words of 16 bits each. The MBM29DL32XTD/BD are offered in a 48-pin TSOP(I) and FBGA Package. These devices are designed to be programmed in-system with the standard system 3.0 V VCC supply. 12.0 V VPP and 5.0 V VCC are not required for write or erase operations. The devices can also be reprogrammed in standard EPROM programmers.

MBM29DL32XTD/BD are organized into two banks, Bank 1 and Bank 2, which can be considered to be two separate memory arrays as far as certain operations are concerned. These devices are the same as Fujitsu's standard 3 V only Flash memories with the additional capability of allowing a normal non-delayed read access from a non-busy bank of the array while an embedded write (either a program or an erase) operation is simultaneously taking place on the other bank.

In the MBM29DL32XTD/BD, a new design concept is implemented, so called "Sliding Bank Architecture". Under this concept, the MBM29DL32XTD/BD can be produced a series of devices with different Bank 1/Bank 2 size combinations; 0.5 Mb/31.5 Mb, 4 Mb/28 Mb, 8 Mb/24 Mb, 16 Mb/16 Mb.

The standard MBM29DL32XTD/BD offer access times 80 ns, 90 ns and 120 ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention the devices have separate chip enable (CE), write enable (WE), and output enable (OE) controls.

The MBM29DL32XTD/BD2 are pin and command set compatible with JEDEC standard E PROMs. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine which controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the devices is similar to reading from 5.0 V and 12.0 V Flash or EPROM devices.

The MBM29DL32XTD/BD are programmed by executing the program command sequence. This will invoke the Embedded Program Algorithm which is an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. Typically, each sector can be programmed and verified in about 0.5 seconds. Erase is accomplished by executing the erase command sequence. This will invoke the Embedded Erase Algorithm which is an internal algorithm that automatically preprograms the array if it is not already programmed before executing the erase operation. During erase, the devices automatically time the erase pulse widths and verify proper cell margin.

A sector is typically erased and verified in 1.0 second. (If already completely preprogrammed.)The devices also feature a sector erase architecture. The sector mode allows each sector to be erased and reprogrammed without affecting other sectors. The MBM29DL32XTD/BD are erased when shipped from the factory.

The devices feature single 3.0 V power supply operation for both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. A low VCC detector automatically inhibits write operations on the loss of power. The end of program or erase is detected by Data Polling of DQ7,by the Toggle Bit feature on DQ6, or the RY/BY output pin. Once the end of a program or erase cycle has been completed, the devices internally reset to the read mode.

Fujitsu's2 Flash technology combines years of EPROM and E PROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MBM29DL32XTD/BD memories electrically erase the entire chip or all bits within a sector simultaneously via Fowler-Nordhiem tunneling. The bytes/words are programmed one byte/word at a time using the EPROM programming mechanism of hot electron injection.

MBM29DL32XTD Maximum Ratings

Parameter

Symbol

Conditions

Rating
Min. Max.

Unit

Storage Temperature

Ambient Temperature with
Power Applied

Voltage with Respect to
Ground All pins except A9,
OE, RESET (Note 1)

Power Supply Voltage
(Note 1)

A9, OE, and RESET
(Note 2)
WP/ACC (Note 3)

Tstg

TA

VIN, VOUT

VCC

VIN

VIN

55 +125

40 +85

0.5 VCC+0.5

0.5 +4.0

0.5 +13.0


0.5 +10.5





°C

°C

V

V

V

V

MBM29DL32XTD Features

0.33 m m Process Technology
Simultaneous Read/Write operations (dual bank)
Multiple devices available with different bank sizes (Refer to Table 1)
Host system can program or erase in one bank, then immediately and simultaneously read from the other bank
Zero latency between read and write operations
Read-while-erase
Read-while-program
Single 3.0 V read, program, and erase
Minimizes system level power requirements

MBM29DL32XTD Connection Diagram

MBM29DL32XTD  Connection Diagram

MBM29DL32XTD datasheet

MBM29DL32XTD
PDF/DataSheet Download

  • Datasheet: MBM29DL32XTD
  • File Size: 1669056 KB
  • Manufacturer: FUJITSU [Fujitsu Media Devices Limited]
  • Click here to Download

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