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Description: The Direct Rambus RIMM module is a general-purpose high-performance memory module subsystem suitable for usein a bro...


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MC-4R512FKE6D General Description


The Direct Rambus RIMM module is a general-purpose high-performance memory module subsystem suitable for usein a broad range of applications including computer memory, personal computers, workstations, and other applications where high bandwidth and low latency are required. MC-4R512FKE6D modules consists of sixteen 288M Direct Rambus DRAM (Direct RDRAM) devices (µPD488588).

These are extremely high-speed CMOS DRAMs organized as 16M words by 18 bits. The use of Rambus SignalingLevel (RSL) technology permits 600MHz, 711MHz or 800MHz transfer rates while using conventional system andboarddesign technologies.

Direct RDRAM devices are capable of sustained data transfers at 1.25 ns per two bytes (10 ns per sixteenbytes).
The architecture of the Direct RDRAM enables the highest sustained bandwidth for multiple, simultaneous,randomly addressed memory transactions. The separate control and data buses with independent rowand column control yield over 95 % bus efficiency. The Direct RDRAM's 32 banks support up to foursimultaneous transactions per device.

MC-4R512FKE6D Maximum Ratings

Symbol Parameter MIN. MAX. Unit
VI,ABS Voltage applied to any RSL or CMOS signal pad with respect to GND −0.3 VDD + 0.3 V
VDD,ABS Voltage on VDD with respect to GND −0.5 VDD + 1.0 V
TSTORE Storage temperature −50 +100

MC-4R512FKE6D Features

• 184 edge connector pads with 1mm pad spacing
• 512 MB Direct RDRAM storage
• Each RDRA has 32 banks, for 512 banks total on modu
• Gold plated contacts
• RDRAMs use Chip Scale Package (CSP)
• Serial Presence Detect support
• Operates from a 2.5 V supply
• Powerdown self refresh modes
• Separate Row and Column buses for higher efficiency
• Over Drive Factor (ODF) support

MC-4R512FKE6D datasheet

MC-4R512FKE6D
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