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Part Number: MC33290D

 

MFG: MOT

 

D/C: 04+

Description: The 33290 is a serial link bus interface device designed to provide bi-directional half-duplex communi...


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MC33290D General Description


The 33290 is a serial link bus interface device designed to provide bi-directional half-duplex communication interfacing in automotive diagnostic applications. It is designed to interface between the vehicle's on-board microcontroller and systems off-board the vehicle via the special ISO K line. The 33290 is designed to meet the Diagnostic Systems ISO9141 specification. The device's K line bus driver's output is fully protected against bus shorts and overtemperature conditions.

The 33290 derives its robustness to temperature and voltage extremes by being built on a SMARTMOS process, incorporating CMOS logic, bipolar/MOS analog circuitry, and DMOS power FETs. Although the 33290 was principally designed for automotive applications, it is suited for other serial communication applications. It is parametrically specified over an ambient temperature range of

-40ºC TA 125ºC and 8.0 V VBB 18 V supply. The economical SO-8 surface-mount plastic package makes the 33290 very cost effective.

MC33290D Maximum Ratings

 

Rating Symbol Value Unit
VDD DC Supply Voltage VDD -0.3 to 7.0 V
VBB Load Dump Peak Voltage VBB(LD) 45 V
ISO Pin Load Dump Peak Voltage (2) VISO 40 V
ISO Short Circuit Current Limit ISO(LIM) 1.0 A
ESD Voltage (3)
Human Body Model (4)
Machine Model (4)
VESD1
VESD2
±2000
±200
V
ISO Clamp Energy (5) Eclamp 10 mJ
Storage Temperature Tstg -55 to +150 °C
Operating Case Temperature TC -40 to +125 °C
Operating Junction Temperature TJ -40 to +150 °C
Power Dissipation
TA = 25°C
PD 0.8 W
Peak Package Reflow Temperature During Reflow (6), (7) TPPRT Note 7. °C
Thermal Resistance
Junction-to-Ambient
RJA 150 °C/W
Notes
2.Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain within specified parametric limits during this duration.
3.ESD data available upon request.
4.ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
5.Nonrepetitive clamping capability at 25°C.
6.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
7.Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standerd J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL),
> Go to www.freescale.com
> Search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx)]
> Locate your Part Number and in the Details column, select "View"
> Select "Environmental and Compliance Information"

MC33290D Features

•Operates Over Wide Supply Voltage of 8.0 to 18 V
•Operating Temperature of -40 to 125°C
•Interfaces Directly to Standard CMOS Microprocessors
•ISO K Line Pin Protected Against Shorts to Ground
•Thermal Shutdown with Hysteresis
•ISO K Line Pin Capable of High Currents
•ISO K Line Can Be Driven with up to 10 nF of Parasitic Capacitance
•8.0 kV ESD Protection Attainable with Few Additional Components
•Standby Mode: No VBat Current Drain with VDD at 5.0 V
•Low Current Drain During Operation with VDD at 5.0 V
•Pb-Free Packaging Designated by Suffix Code EF

MC33290D Connection Diagram

MC33290D  Connection Diagram

MC33290D datasheet

MC33290D/R2
PDF/DataSheet Download

  • Datasheet: MC33290D/R2
  • File Size: 231715 KB
  • Manufacturer: FREESCALE [Freescale Semiconductor, Inc]
  • Click here to Download

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