MFG:MOTOROLA Package Cooled:SMD D/C:00+
MFG: MOTOROLA
Package Cooled: SMD
D/C: 00+
Description: The 33996 is a 16-output low-side switch with a 24-bit serial input control. It is designed for a vari...
The 33996 is a 16-output low-side switch with a 24-bit serial input control. It is designed for a variety of applications including inductive, incandescent, and LED loads. The Serial Peripheral Interface (SPI) provides both input control and diagnostic readout. A Pulse Width Modulation (PWM) control input is provided for pulse width modulation of multiple outputs at the same duty cycle. A dedicated reset input provides the ability to clear all internal registers and turn all outputs off.
The 33996 directly interfaces with micro controllers and is compatible with both 3.3 V and 5.0 V CMOS logic levels. The 33996, in effect, serves as a bus expander and buffer with fault management features that reduce the MCU's fault management burden.
| Rating | Symbol | Value | Unit |
| VPWR Supply Voltage (1) | VPWR | -1.5 to 50 | V |
| SO Output Driver Power Supply Voltage (1) | SOPWR | -0.3 to 7.0 | V |
| SPI Interface Logic Input Voltage (CS, PWM, SI, SO, SCLK, RST) (1) | VIN | -0.3 to 7.0 | V |
| Output Drain Voltage | VD | -0.3 to 45 | V |
| Frequency of SPI Operation (2) | fSPI | 6.0 | MHz |
| Output Clamp Energy (3) | ECLAMP | 50 | mJ |
| ESD Voltage (4) Human Body Model Machine Model |
VESD1 VESD2 |
±2000 ±200 |
V |
| Operating Temperature Ambient Junction Cas |
TA TJ TC |
-40 to 125 -40 to 150 -40 to 125 |
|
| Storage Temperature | TSTG | -55 to 150 | |
| Power Dissipation (TA = 25) (5) | PD | 1.7 | W |
| Peak Package Reflow Temperature During Reflow (6), (7) | TPPRT | Note 7 | |
| Thermal Resistance Junction-to-Ambient (8) Junction- to-Lead (9) Junction-to-Flag |
RJA RJL RJC |
75 8.0 1.2 |
/W |
Notes
1.Exceeding these limits may cause malfunction or permanent damage to the device.
2.This parameter is guaranteed by design but not production tested.
3.Maximum output clamp energy capability at 150°C junction temperature using single nonrepetitive pulse method.
4.ESD data available upon request. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ) and the Machine Model (CZAP = 200 pF, RZAP = 0 ).
5.Maximum power dissipation with no heat sink used.
6.Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
7.Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
8.Tested per JEDEC test JESD52-2 (single-layer PWB).
9.Tested per JEDEC test JESD51-8 (two-layer PWB).
MC33996
PDF/DataSheet Download
IC SWITCH I/O INTERFACE 32-SOIC
MC33993 22-MULTIPLE SWITCH DETECTION INTERFACE
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