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Part Number: MC34652

 

 

 

 

Description: The 34652 is a highly integrated -48 V hot swap controller with an internal Power MOSFET. It provides ...


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MC34652 General Description


The 34652 is a highly integrated -48 V hot swap controller with an internal Power MOSFET. It provides the means to safely install and remove boards from live -48 V backplanes without having to power down the entire system. It regulates the inrush current, from the supply to the load’s filter capacitor, to a user-programmable limit, allowing the system to safely stabilize. A disable function allows the user to disable the 34652 manually or through a microprocessor and safely disconnect the load from the main power line.

The 34652 has active high and active low power good output signals that can be used to directly enable a power module load. Programmable under- and overvoltage detection circuitry monitors the input voltage to check that it is within its operating range. A programmable start-up delay timer ensures that it is safe to turn on the Power MOSFET and charge the load capacitor.

A two-level current limit approach to controlling the inrush current and switching on the load limits the peak power dissipation in the Power MOSFET. Both current limits are user programmable.

MC34652 Maximum Ratings

Ratings Symbol Value Unit
ELECTRICAL RATINGS
Power Supply Voltage VPWR 85 V
Power MOSFET Energy Capability EMOSFET Varies(1) mJ
Continuous Output Current (2) IO(CONT) 2.0 A
Maximum Voltage
DISABLE Terminal
UV Terminal
OV, ILIM, ICHG, and TIMER Terminals
PG Terminal (VPG - VIN)
PG Terminal (VPG - VIN)
  VIN - 0.3 to VPWR + 5.5
7.0
5.0
85
85
V
All Terminals Minimum Voltage   -0.3 V
PG, PG Maximum Current   Internally Limited A
ESD Voltage, All Terminals
Human Body Model (3)
Machine Model (4)
VESD3
VESD4
±2000
±200
V
THERMAL RATINGS
Storage Temperature TSTG -65 to 150 °C
Operating Temperature
Ambient (5)
Junction
TA
TJ
-40 to 85
-40 to 160
°C
Peak Package Reflow Temperature During Solder Mounting (6) TSOLDER 260 °C
Thermal Resistance (7), (8)
Junction-to-Ambient, Single-Layer Board (9)
Junction-to-Ambient, Four-Layer Board (10)
RJA
RJMA
103
65
°C/W
Notes
1. Refer to the section titled Power MOSFET Energy Capability on page 22 for a detailed explanation on this parameter.
2. Continuous output current capability so long as TJ is 160°C.
3. ESD1 testing is performed in accordance with the Human Body Model (CZAP=100pF, RZAP=1500 ).
4. ESD2 testing is performed in accordance with the Machine Model (CZAP=200 pF, RZAP=0 ).
5. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.
6. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits
   may cause malfunction or permanent damage to the device.
7. Refer to the section titled Thermal Shutdown on page 15 for more thermal resistance values under various conditions.
8. The VOUT and VIN terminals comprise the main heat conduction paths.
9. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the board.

MC34652 Features

· Integrated Power MOSFET and Control IC in a Small Outline Package
· Input Voltage Operation Range from -15 V to -80 V
· Programmable Overcurrent Limit with Auto Retry
· Programmable Charging Current Limit Independent of Load Capacitor
· Programmable Start-Up and Retry Delay Timer
· Programmable Overvoltage and Undervoltage Detection
· Active High and Low Power Good Output Signals
· Thermal Shutdown
· Pb-Free Packaging Designated by Suffix Code EF

MC34652 Connection Diagram

MC34652  Connection Diagram

MC34652 datasheet

MC34652
PDF/DataSheet Download

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