Purchase MC54HC02, In-stock MC54HC02 From SeekIC.
Package Cooled:DIP D/C:84+

Package Cooled:DIP D/C:84+

| Symbol | Parameter | Value | Unit |
| VCC | DC Supply Voltage (Referenced to GND) | -0.5CCto+7.0 | V |
| Vin | DC Input Voltage (Referenced to GND) | -0.5to VCC + 0.5 | V |
| Vout | DC Output Voltage (Referenced to GND) | -0.5to VCC + 0.5 | V |
| Lin | DC Input Current, per Pin | ±20 | mA |
| lout | DC Output Current, per Pin | ±25 | mA |
| ICC | DC Supply Current, VCC and GND Pins | ±50Z | mA |
| PD | Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ TSSOP Package+ |
750 500 450 |
mVV |
| Tstg | Storage Temperature | ||
| TL | Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package Ceramic DIP | 260 300 |
The MC54/74HC02A is identical in pinout to the LS02. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0A
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 40 FETs or 10 Equivalent Gates
MC54HC02AJ
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