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Package Cooled:DIP  D/C:84+  

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Part Number: MC54HC02

 

 

Package Cooled: DIP

D/C: 84+

 

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MC54HC02 Maximum Ratings

Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) -0.5CCto+7.0 V
Vin DC Input Voltage (Referenced to GND) -0.5to VCC + 0.5 V
Vout DC Output Voltage (Referenced to GND) -0.5to VCC + 0.5 V
Lin DC Input Current, per Pin ±20 mA
lout DC Output Current, per Pin ±25 mA
ICC DC Supply Current, VCC and GND Pins ±50Z mA
PD
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
TSSOP Package+

750

500

450

mVV
Tstg Storage Temperature  
TL Lead Temperature, 1 mm from Case for 10 Seconds Plastic DIP, SOIC or TSSOP Package Ceramic DIP
260

300

MC54HC02 Features

   The MC54/74HC02A is identical in pinout to the LS02. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.
   Output Drive Capability: 10 LSTTL Loads
   Outputs Directly Interface to CMOS, NMOS, and TTL
   Operating Voltage Range: 2.0 to 6.0 V
   Low Input Current: 1.0A
   High Noise Immunity Characteristic of CMOS Devices
   In Compliance with the Requirements Defined by JEDEC Standard
   No. 7A
   Chip Complexity: 40 FETs or 10 Equivalent Gates

MC54HC02 Connection Diagram

MC54HC02  Connection Diagram

MC54HC02 datasheet

MC54HC02AJ
PDF/DataSheet Download

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