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MFG:ON  Package Cooled:20 LEAD PDIP  D/C:07+  

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Part Number: MC74HCT273AN

 

MFG: ON

Package Cooled: 20 LEAD PDIP

D/C: 07+

Description: The MC74HCT273A may be used as a level converter for interfacing TTL or NMOS outputs to HighSpeed CMOS...


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MC74HCT273AN General Description


The MC74HCT273A may be used as a level converter for interfacing TTL or NMOS outputs to HighSpeed CMOS inputs.

The HCT273A is identical in pinout to the LS273.

This device consists of eight D flipflops with common Clock and Reset inputs. Each flipflop is loaded with a lowtohigh transition of the Clock input. Reset is asynchronous and active low.

MC74HCT273AN Maximum Ratings

Symbol Parameter Value Unit
vcc DC Supply Voltage (Referenced to GND) 0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) 0.5 to VCC + 0.5 V
VOUT DC Output Voltage (Referenced to GND) 0.5 to VCC + 0.5 V
LIN DC Input Current, per Pin ±20 mA
IOUT DC Onput Current, per Pin ±35 mA
ICC DC Supply Current Per Supply Pin ±75 mA
PD Power dissipation in still air piastic DIP
SOIC package
750
500
mW
TSTG Storage Temperature 65 to +150 °C
TL Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
260 °C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating - Plastic DIP: 10 mW/C from 65 to 125C
SOIC Package: 7 mW/C from 65 to 125C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).

MC74HCT273AN Features

• Output Drive Capability: 10 LSTTL Loads
• TTL/NMOS Compatible Input Levels
• Outputs Directly Interface to CMOS, NMOS and TTL
• Operating Voltage Range: 4.5 to 5.5 V
• Low Input Current: 1.0 mA
• In Compliance with the Requirements Defined by JEDEC Standard No. 7A
• Chip Complexity: 284 FETs or 71 Equivalent Gates

MC74HCT273AN Connection Diagram

MC74HCT273AN  Connection Diagram

MC74HCT273AN datasheet

MC705C8ACFNR2
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