MCP18480

Ambient Temperature under bias........ 40°C to +85°C
Storage Temperature ........................ 65°C to +150°C
Voltage on VPOS with respect to VNEG -0.3V to +15.0V Voltage on DVTH, UVTH, VFB, OVO and UVHYS pins with respect to VNEG .....VNEG 0.3V to (VPOS + 0.3V) Voltage on VREFIN, CL, SENSE, DRAINTH, ENABLE and RESTART pins with respect to VNEG .................VNEG - 0.3V to 6V.
Total Power Dissipation (Note 1) .................... 800 mW
Max. Current out of VNEG pin.............................80 mA
Max. Current into VPOS pin ................................50 mA
Max. Output Current sunk by Gate pin...............80 mA
Max. Output Current sunk by VREFOUT pin ..........5 mA
Max. Output Current sunk by any other
Output pin.........................................................25 mA
Max. Output Current sourced by Gate pin ........200 A
Max. Output Current sourced by VREFOUT pin .....5 mA
Max. Output Current sourced by any other
Output pin...........................................................25 mA
Junction to Ambient, JA
(20 pin SSOP Package) Derating ...............108.1°C/W
Junction to Case, JC
(20 pin SSOP Package) Derating .................32.2°C/W
Lead Temperature, Soldering, 10 seconds ........ 300°C
† Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Note 1: Power Dissipation is calculated as follows: PDIS = VDD x {I_DD - I_OH} + {(V_DD-V_OH) x I_OH} + (V_OL x I_OL)