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|
Parameter |
Symbol |
Value |
Unit |
|
Peak Repetitive Forward and Reverse Blocking Voltage(1) (TJ = 25 to 110°C, RGK = 1 kW) MCR506-2 MCR506-3 MCR506-4 MCR506-6 MCR506-8 |
VDRM VRRM |
50 100 200 400 600 |
Volts |
|
RMS Forward Current (All Conduction Angles) |
IT(RMS) |
6 |
A |
|
Average Forward Current (TC = 93°C) |
ITSM |
3.82 |
A |
|
Peak Non-repetitive Surge Current (1/2 Cycle, 60 Hz, TJ = 40 to 110°C) |
I2t |
40 |
A2sec |
|
Circuit Fusing Considerations (t = 8.3 ms) |
PGM |
2.6 |
Watts |
|
Peak Gate Power |
PG(AV) |
0.1 |
Watts |
|
Peak Forward Gate Current |
IGM |
0.2 |
A |
| Peak Reverse Gate Voltage | VRGM | 6 | Volts |
|
Operating Junction Temperature Range |
TJ |
40 to +110 |
°C |
|
Storage Temperature Range |
Tstg |
40 to +150 |
°C |
| Mounting Torque(2) | - | 6 | in. lb. |
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are xceeded.
2. Torque rating applies with use of torque washer (Shakeproof WD19523 or equivalent). Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heat sink contact pad are common. (See AN290 B) For soldering purposes (either terminal connection or device mounting), soldering temperatures shall not exceed +225°C. For optimum results, an activated flux (oxide removing) is recommended.
MCR506
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