MCR506

Specifications Parameter Symbol Value Unit Peak Repetitive Forward and Reverse Blocking Voltage(1)(TJ = 25 to 110°C, RGK = 1 kW)MCR506-2MCR506-3MCR506-4MCR506-6MCR506-8 VDRMVRRM 50100200400600 Volts RMS Forward Current (All Conduction Angles) IT(RMS) 6 A...

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SeekIC No. : 004418727 Detail

MCR506: Specifications Parameter Symbol Value Unit Peak Repetitive Forward and Reverse Blocking Voltage(1)(TJ = 25 to 110°C, RGK = 1 kW)MCR506-2MCR506-3MCR506-4MCR506-6MCR506-8 VDRMV...

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Part Number:
MCR506
Supply Ability:
5000

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  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/20

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Product Details

Description



Specifications

Parameter
Symbol
Value
Unit
Peak Repetitive Forward and Reverse Blocking Voltage(1)
(TJ = 25 to 110°C, RGK = 1 kW)
MCR506-2
MCR506-3
MCR506-4
MCR506-6
MCR506-8
VDRM
VRRM
50
100
200
400
600
Volts
RMS Forward Current (All Conduction Angles)
IT(RMS)
6
A
Average Forward Current (TC = 93°C)
ITSM
3.82
A
Peak Non-repetitive Surge Current (1/2 Cycle, 60 Hz, TJ = 40 to 110°C)
I2t
40
A2sec
Circuit Fusing Considerations (t = 8.3 ms)
PGM
2.6
Watts
Peak Gate Power
PG(AV)
0.1
Watts
Peak Forward Gate Current
IGM
0.2
A
                       Peak Reverse Gate Voltage        VRGM            6       Volts
Operating Junction Temperature Range
TJ
40 to +110
°C
Storage Temperature Range
Tstg
40 to +150
°C
                                Mounting Torque(2)          -            6       in. lb.

1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are xceeded.
2. Torque rating applies with use of torque washer (Shakeproof WD19523 or equivalent). Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heat sink contact pad are common. (See AN290 B) For soldering purposes (either terminal connection or device mounting), soldering temperatures shall not exceed +225°C. For optimum results, an activated flux (oxide removing) is recommended.




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