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MFG:MITSUBISHI  Package Cooled:SMD  

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Part Number: MGF7170AC

 

MFG: MITSUBISHI

Package Cooled: SMD

 

Description: The MGF7170AC is a monolithic microwave integrated circuit for use in CDMA base handheld phone.


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MGF7170AC General Description


The MGF7170AC is a monolithic microwave integrated circuit for use in CDMA base handheld phone.

MGF7170AC Maximum Ratings

Symbol Parameter Ratings Unit
Vd1,Vd2 Drain voltage 6 V
Vg Gate voltage 4 V
Pi Input power 15 dBm
Tc(op) Operating case temperature -30 ~ +85 deg.C
Tstg Storage temperature -30 ~ +100 deg.C

MGF7170AC Features

-Low voltage operation :
·Vd=3.0V
-High output power :
·Po=28dBm typ. @f=1.715~1.78GHz
-Low distortion :
·ACP=-46dBc max. @Po=28dBm
-High efficiency :
·Id=520mA typ. @Po=28dBm
-Small size :
·7.0 x 6.1 x 1.1 mm
·Single voltage operation (NVG include)
·Surface mount package
·2 Stage Amplifier
·External matching circuit is required

MGF7170AC Typical Application

·1.9GHz band handheld phone

MGF7170AC Connection Diagram

MGF7170AC Connection Diagram

MGF7170AC datasheet

MGF7170AC
PDF/DataSheet Download

  • Datasheet: MGF7170AC
  • File Size: 324305 KB
  • Manufacturer: MITSUBISHI [Mitsubishi Electric Semiconductor]
  • Click here to Download

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