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MFG:3000  Package Cooled:ON  D/C:07+  

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MGS Series Datasheet download

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Part Number: MGSF2N02EL

 

MFG: 3000

Package Cooled: ON

D/C: 07+

 

Urgent Purchase

MGSF2N02EL Maximum Ratings

Rating Symbol Value Unit
Drain−to−Source Voltage VDSS 20 Vdc
Gate−to−Source Voltage − Continuous VGS ± 8.0 Vdc
Drain Current
− Continuous @ TA = 25°C
− Single Pulse (tp = 10 s)
ID
IDM
2.8
5.0
A
Total Power Dissipation @ TA = 25°C PD 1.25 W
Operating and Storage Temperature
Range
TJ, Tstg − 55 to150  
Thermal Resistance
Junction−to−Ambient (Note 1)
Thermal Resistance
Junction−to−Ambient (Note 2)
RJA 100
300
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds
TL 260 °C
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. 1" Pad, t < 10 sec.
2. Min pad, steady state.

MGSF2N02EL Features

• Pb−Free Packages are Available
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• IDSS Specified at Elevated Temperature

MGSF2N02EL Typical Application

• DC−DC Converters
• Power Management in Portable and Battery Powered Products, ie: Computers, Printers, PCMCIA Cards, Cellular and Cordless Telephones

MGSF2N02EL datasheet

MGSF2N02EL
PDF/DataSheet Download

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