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MGSF2N02EL

Features: • Pb−Free Packages are Available• Low RDS(on) Provides Higher Efficiency and Extends Battery Life• Miniature SOT−23 Surface Mount Package Saves Board Space• IDSS Specified at Elevated TemperatureApplication• DC−DC Converters• Power Ma...

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SeekIC No. : 004419989 Detail

MGSF2N02EL: Features: • Pb−Free Packages are Available• Low RDS(on) Provides Higher Efficiency and Extends Battery Life• Miniature SOT−23 Surface Mount Package Saves Board Space...

MGSF2N02EL Data Sheet

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Part Number:
MGSF2N02EL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2026/1/29

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Product Details

Description



Features:

• Pb−Free Packages are Available
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• IDSS Specified at Elevated Temperature


Application

• DC−DC Converters
• Power Management in Portable and Battery Powered Products, ie: Computers, Printers, PCMCIA Cards, Cellular and Cordless Telephones


Specifications

Rating Symbol Value Unit
Drain−to−Source Voltage VDSS 20 Vdc
Gate−to−Source Voltage − Continuous VGS ± 8.0 Vdc
Drain Current
− Continuous @ TA = 25°C
− Single Pulse (tp = 10 s)		 ID
IDM		 2.8
5.0		 A
Total Power Dissipation @ TA = 25°C PD 1.25 W
Operating and Storage Temperature
Range		 TJ, Tstg − 55 to150  
Thermal Resistance
Junction−to−Ambient (Note 1)
Thermal Resistance
Junction−to−Ambient (Note 2)		 RJA 100
300		 °C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds		 TL 260 °C
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. 1" Pad, t < 10 sec.
2. Min pad, steady state.


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