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Part Number: MH16V72TJ-7

 

 

 

 

Description: The MH16V72TJ is 16777216-word x 72-bit dynamic ram module. This consist of eighteen industry standard...


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MH16V72TJ-7 General Description


The MH16V72TJ is 16777216-word x 72-bit dynamic ram module. This consist of eighteen industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP.

The mounting of TSOP on a card edge dual in-line package provides any application where high densities and large of quantities memory are required.

This is a socket-type memory module ,suitable for easy interchange or addition of module.

MH16V72TJ-7 Maximum Ratings

Symbol
Parameter
Conditions
Ratings
Unit
Vcc
Supply voltage With respect to Vss
-0.5~4.6
V
VI
Input voltage
-0.5~Vcc+0.5
VO
Output voltage
-0.5~Vcc+0.5
IO Output current
 
50
mA
Pd Power dissipation Ta=25°C
20
W
Topr Operating temperature
 
0~70
°C
Tstg Storage temperature  
-40~100
°C

MH16V72TJ-7 Features

Utilizes industry standard 16M x 4 RAMs TSOP and industry
standard input buffer in TSSOP
168-pin (84-pin dual in-line package)
Single +3.3V(±0.3V) supply operation
Low stand-by power dissipation . . . . . . . . 68.4mW(Max)
Low operation power dissipation
      MH16V72TJ -6 . . . . . . . . . . . . . . . . . . 6.52W(Max)
      MH16V72TJ -7 . . . . . . . . . . . . . . . . . . 5.54W(Max)
All input are directly TTL compatible
All output are three-state and directory LVTTL compatible
Includes(0.22uF x 20) decoupling capacitors
4096 refresh cycle every 64ms
Fast page mode
JEDEC standard pin configuration & Buffered PD pin
Buffered input except /RAS and DQ
Gold plating contact pads

MH16V72TJ-7 Typical Application

Main memory unit for computers , Microcomputer memory

MH16V72TJ-7 datasheet

MH1
PDF/DataSheet Download

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