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Part Number: MH32V7245BST -6

 

 

 

 

Description: The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-sixindustr...


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MH32V7245BST -6 General Description


The MH32V7245BST is 33554432-word x 72-bit dynamic ram stacked structural module. This consist of thirty-six
industry standard 16M x 4 dynamic RAMs in TSOP and two industry standard input buffer in TSSOP.

The stacked structure of TSOP on a card edge dual in-line package provides any application where high densities and
large of quantities memory are required.

This is a socket-type memory module ,suitable for easy interchange or addition of module.

MH32V7245BST -6 Maximum Ratings

Symbol Parameter Conditions Ratings Unit
Vcc Supply voltage With respect to Vss -0.5~4.6 V
IO Output current   50 mA
Pd Power dissipation Ta=25°C 20 W
Topr Operating temperature   0~70 °C
Tstg Storage temperature   -40~100 °C

MH32V7245BST -6 Features

·Utilizes industry standard 16M x 4 RAMs TSOP and industry standard input buffer in TSSOP
·168-pin (84-pin dual dual in-line package) stacked structure
·Single 3.3V(+/- 0.3V) supply operation
·Low stand-by power dissipation . . . . . . . .  . . 64.9mW(Max)
·Low operation power dissipation
            MH32V7245BST -5 . . . . . . . . . . . . . . . . . . 8.44W(Max)
            MH32V7245BST -6 . . . . . . . . . . . . . . . . . . 7.79W(Max)
·All input are directly LVTTL compatible
·All output are three-state and directry LVTTL compatible
·Includes(0.22 uF x 38) decoupling capacitors
·4096 refresh cycle every 64ms (A0 - A11)
·Hyper-page mpde,Read-modify-write,/CAS before /RAS refresh, Hidden refresh capabilities
·JEDEC standard pin configration & Buffered PD pin
·Buffered input except /RAS and DQ
·Gold plating contact pads

MH32V7245BST -6 Typical Application

Main memory unit for computers , Microcomputer memory

MH32V7245BST -6 datasheet

MH32V7245BST -6
PDF/DataSheet Download

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