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Part Number: MLG1608B27NJ-T

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Description: The MLG1608B27NJ-T is one member of the MLG1608 family that can be used in mobile phones, portable phones, cordless phone...


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MLG1608B27NJ-T General Description


The MLG1608B27NJ-T is one member of the MLG1608 family that can be used in mobile phones, portable phones, cordless phones, pagers and personal handy-phone systems (PHS) applications. Features of the MLG1608B27NJ-T are:(1)Supports operating frequency bands of up to 10GHz with nominal inductance values from 1 to 100nH.; (2)Provides high Q characteristics.; (3)Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency.

The handling and precautions of the MLG1608B27NJ-T can be summarized as:(1)Before soldering, be sure to preheat components; (2)The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150 ; (3)After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling; (4)When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 260 . Soldering time should not exceed 3 seconds. If you want to know more information such as the electrical characteristics about the MLG1608B27NJ-T, please download the datasheet in www.seekic.com or www.chinaicmart.com.

MLG1608B27NJ-T datasheet

MLG0402S10NJT
PDF/DataSheet Download

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