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MFG:ON  D/C:06+  

MMBV3700LT1 Product Image

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Part Number: MMBV3700LT1

 

MFG: ON

 

D/C: 06+

Description: These devices are designed primarily for VHF band switching applications but are also suitable for use...


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MMBV3700LT1 General Description


These devices are designed primarily for VHF band switching applications but are also suitable for use in generalpurpose switching circuits. They are supplied in a costeffective plastic package for economical, highvolume consumer and industrial requirements. They are also available in surface mount

MMBV3700LT1 Features

• Long Reverse Recovery Time trr = 300 ns (Typ)
• Rugged PIN Structure Coupled with Wirebond Construction for Optimum Reliability
• Low Series Resistance @ 100 MHz RS = 0.7 Ohms (Typ) @ IF = 10 mAdc
• Reverse Breakdown Voltage = 200 V (Min)

MMBV3700LT1 Typical Application

Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection

interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process.

MMBV3700LT1 Connection Diagram

Rating
Symbol
MPN3700
MMBV3700LT1
Unit
Reverse Voltage
VR
200
Vdc
Total Power Dissipation
@ TA = 25
Derate above 25
PD
280
2.8
200
2.0
mW
mW/
Junction Temperature
TJ
+125
Storage Temperature Range
Tstg
55 to +150

MMBV3700LT1 datasheet

MMBV3700LT1
PDF/DataSheet Download

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