Features: Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes Pinout Specifications Part Number MMBZ5221BW Power Rating (mW) 200 NomVZ 2.4 @ IZT (mA) 20 Tol V (typ) (%) 5 IR (µA) 100 ...
MMBZ5221BW: Features: Planar Die Construction Ultra-Small Surface Mount Package General Purpose Ideally Suited for Automated Assembly Processes Pinout Specifications Part Number MMBZ5221BW Power ...
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| Part Number | MMBZ5221BW |
| Power Rating (mW) | 200 |
| NomVZ | 2.4 |
| @ IZT (mA) | 20 |
| Tol V (typ) (%) | 5 |
| IR (µA) | 100 |
| Characteristic | Symbol | Value |
Unit |
| Forward Voltage (Note 2) @ IF = 10mA | VF | 0.9 | V |
| Power Dissipation (Note 1) | Pd | 200 | mW |
| Thermal Resistance, Junction to Ambient Air (Note 1) | RJA | 625 | °C/W |
| Operating and Storage Temperature Range | Tj,TSTG | 65 to +150 | °C |