Features: *Ultra-Small Surface Mount Package *Planar Die Construction *General Purpose *Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Unit ZenerCurrent (See Table on page 2) - - - Forward Voltage @ IF = 10mA VF 0.9 V Power Dissipation (...
MMBZ5223BT: Features: *Ultra-Small Surface Mount Package *Planar Die Construction *General Purpose *Ideally Suited for Automated Assembly ProcessesSpecifications Parameter Symbol Value Unit ZenerCurr...
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| Parameter | Symbol | Value | Unit |
| ZenerCurrent (See Table on page 2) | - | - | - |
| Forward Voltage @ IF = 10mA | VF | 0.9 | V |
| Power Dissipation (Note 1) | PD | 150 | mW |
| Thermal Resistance, Junction to Ambient (Note 1) | RJA | 833 | °C/W |
| Operating and Storage Temperature Range | TJ, TSTG | -55~150 | °C |
| Part Number | MMBZ5223BT |
| Power Rating (mW) | 150 |
| NomVZ | 2.7 |
| @ IZT (mA) | 20 |
| Tol V (typ) (%) | 5 |
| IR (µA) | 75 |