Features: ·Epitaxial Planar Die Construction ·Ideal for Low Power Amplification and Switching·Ultra-Small Surface Mount PackagePinout Specifications Part Number MMDT2907A Product Type PNP + PNP VCEO (V) -60 IC (A) -0.6 ICM (A) - PD (W) 0.2 hFE Min 100 hFE Ma...
MMDT2907A: Features: ·Epitaxial Planar Die Construction ·Ideal for Low Power Amplification and Switching·Ultra-Small Surface Mount PackagePinout Specifications Part Number MMDT2907A Product Type PN...
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·Epitaxial Planar Die Construction
·Ideal for Low Power Amplification and Switching
·Ultra-Small Surface Mount Package

| Part Number | MMDT2907A |
| Product Type | PNP + PNP |
| VCEO (V) | -60 |
| IC (A) | -0.6 |
| ICM (A) | - |
| PD (W) | 0.2 |
| hFE Min | 100 |
| hFE Max | 300 |
| @ IC (A) | -0.15 |
| VCE (SAT) Max (mV) | -400 |
| @ IC (A) | -0.15 |
| @ IB (mA) | -15 |
| fT Min (MHz) | 200 |
| RCE (SAT) (m) | - |
|
Characteristic |
Symbol |
MMDT2907A |
Unit |
| Collector-Base Voltage |
VCBO |
-60 |
V |
| Collector-Emitter Voltage |
VCEO |
-60 |
V |
| Emitter-Base Voltage |
VEBO |
-5.0 |
V |
| Collector Current - Continuous (Note 1) |
IC |
-600 |
mA |
| Power Dissipation (Note 1,2) |
Pd |
200 |
mW |
| Thermal Resistance, Junction to Ambient (Note 1) |
RJA |
625 |
K/W |
| Operating and Storage and Temperature Range |
Tj,TSTG |
-55 to +150 |
Notes:
`Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.