Features: · Planar Die Construction· Ultra-Small Surface Mount Package· General Purpose· Ideally suited for Automated Assembly Processes· Lead Free /RoHS Compliant (Note 3)Specifications Part Number MMSZ5259BS Power Rating (mW) 200 NomVZ 39 @ IZT (mA) 3.2 Tol V (typ) (%) ...
MMSZ5259BS: Features: · Planar Die Construction· Ultra-Small Surface Mount Package· General Purpose· Ideally suited for Automated Assembly Processes· Lead Free /RoHS Compliant (Note 3)Specifications Part N...
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| Part Number | MMSZ5259BS |
| Power Rating (mW) | 200 |
| NomVZ | 39 |
| @ IZT (mA) | 3.2 |
| Tol V (typ) (%) | 5 |
| IR (µA) | 0.1 |
| Characteristic | Symbol | Value | Unit |
| Forward Voltage (Note 2) @ IF = 10mA | VF | 0.9 | V |
| Power Dissipation (Note 1) | Pd | 200 | mW |
| Thermal Resistance, Junction to Ambient Air (Note 1) | RJA | 625 | °C/W |
| Operating and Storage Temperature Range | Tj, TSTG | -65 to +150 | °C |
Notes: 1. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.