MNLP2953AM-X

Storage Temperature Range
      ........-65 C < TA < +150 C
Operating Temperature Range
      ........-55 C < TA < +125 C
Maximum Junction Temperature
     ...............+150 C
Lead Temperature
(Soldering, 5 seconds).. ... 260 C
Power Dissipation
(Note 2, 3)
       .........Internally Limited
Input Supply Voltage
      ............-20V to +30V
Feedback Input Voltage
(Note 4)
     ............-0.3V to +5V
Comparator Input Voltage
(Note 5)
    ............-0.3V to +30V
Shutdown Input Voltage
(Note 5)
     ............-3.0V to +30V
Comparator Output Voltage
(Note 5)
    ............-0.3V to +30V
Thermal Resistance
(Note 3)
ThetaJA
CERDIP (Still Air) ........74 C/W
(500LF/Min Air flow) .. ....33 C/W
CERAMIC SOIC (Still Air)....134 C/W
(500LF/Min Air flow).... .. 81 C/W
ThetaJC
CERDIP .............3 C/W
CERAMIC SOIC...... ... 7 C/W
Package Weight
(Typical)
CERDIP.............. TBD
CERAMIC SOIC.........360mg
ESD Tolerance
(Note 6)
          ...............2kV

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.

Note 2: The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.