MOC216 General Description
MOC216 Features
• Convenient Plastic SOIC8 Surface Mountable Package Style
• Low LED Input Current Required, for Easier Logic Interfacing
• Standard SOIC8 Footprint, with 0.050, Lead Spacing
• Shipped in Tape and Reel, which Conforms to EIA Standard RS481A
• Compatible with Dual Wave, Vapor Phase and IR Reflow Soldering
• High InputOutput Isolation of 3000 Vac (rms) Guaranteed
• UL Recognized File #E54915
MOC216 Typical Application
• Low power Logic Circuits
• Interfacing and coupling systems of different potentials and impedances
• Telecommunications equipment
• Portable electronics
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