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MFG:FSC  Package Cooled:Through Hole  D/C:08+  

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Part Number: MOC70P3

 

MFG: FSC

Package Cooled: Through Hole

D/C: 08+

Description: The MOC70PX consists of an infrared light emitting diode coupled to an NPN silicon phototransistor pac...


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MOC70P3 General Description


The MOC70PX consists of an infrared light emitting diode coupled to an NPN silicon phototransistor packaged into an injection molded housing. The housing is designed for wide gap, non contact sensing.

MOC70P3 Maximum Ratings

Parameter
Symbol
Rating
Units
Operating Temperature
TOPR
-55 to +100
Storage Temperature
TSTG
-55 to +100
Soldering Temperature (Iron)(2,3,4,5)
TSOL-I
240 for 5 sec
Soldering Temperature (Flow)(2,3,5)
TSOL-F
260 for 10 sec
EMITTER
Continuous Forward Current
IF
50
mA
Reverse Voltage
VR
6
V
Power Dissipation(1)
PD
100
mW
SENSOR
Collector-Emitter Voltage
VCEO
30
V
Emitter-Collector Voltage
VECO
4.5
V
Collector Current
IC
20
mA
Power Dissipation(1)
PD
150
mW

MOC70P3 Features

• No contact sensing
• 5 mm gap
• .040" aperture
• Low profile
• PCB mount
• Transistor output

MOC70P3 datasheet

MOC70P3
PDF/DataSheet Download

  • Datasheet: MOC70P3
  • File Size: 82722 KB
  • Manufacturer: FAIRCHILD [Fairchild Semiconductor]
  • Click here to Download

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