MFG:MP Package Cooled:SOP20 D/C:07/08+
MFG: MP
Package Cooled: SOP20
D/C: 07/08+
Description: The MP8775 is an 8-bit Analog-to-Digital Converter in a small 20 pin SOIC package. Designed using an a...
The MP8775 is an 8-bit Analog-to-Digital Converter in a small 20 pin SOIC package. Designed using an advanced 5 V CMOS process, this part offers excellent
performance, low power consumption and latch-up free operation.
This device uses a two-step flash architecture tomaintain low power consumption at high conversion rates. The input circuitry of the MP8775 includes an on-chip S/H function and allows the user to digitize analog input signals between GND and VDD. Careful design and chip layout have achieved a low analog input capacitance. This reduces "kickback" and eases the requirements of the buffer/amplifier used to drive the MP8775.
The designer can choose the internally generated reference voltages by connecting VRB to VRBS and VRT to VRTS, or provide external reference voltages to the VRB and VRT pins. The internal reference generates 0.6 V at VRB and 2.6 V at VRT. Providing external reference voltages allows easy interface to any input signal range between GND and VDD. This also allows the system to adjust these voltages to cancel zero scale and full scale errors, or to change the input range as needed.
The device operates from a single +5 V supply. Power consumption is 85 mW at Fs = 20 MHz.
Specified for operation over the commercial / industrial (--40 to +85°C) temperature range, the MP8775 is available in Surface Mount (SOIC), Shrunk Small Outline (SSOP) and Plastic dual-in-line (PDIP) packages.
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 V
VRT & VRB . . . . . . . . . . . . . . . . . . . . . . . VDD +0.5 to GND --0.5 V
VIN . . . . . . . . . . . . . . . . . . . . . .. . . . . . .VDD +0.5 to GND --0.5 V
All Inputs . . . . . . . . . . . . . . . . . . .. . . . .VDD +0.5 to GND --0.5 V
All Outputs . . . . . . . . . . . . . . . . .. . . . . .VDD +0.5 to GND --0.5 V
Storage Temperature . . . . . . . . . . . . . . . . . . . . . --65 to +150°C
Lead Temperature (Soldering 10 seconds) . . . . . .. . . . . .+300°C
Package Power Dissipation Rating @ 75°C
SOIC, SSOP, PDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .700 mW
Derates above 75°C . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 mW/°C
Notes:
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. All inputs have protection diodes which will protect the device from short transients outside the supplies of less than 100mA for less than 100ms.
3 VDD refers to AVDD and DVDD. GND refers to AGND and DGND.
MP8775
PDF/DataSheet Download
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