MPL4700

MPL4700 series of surface mount PIN and Varactor diodes utilize new and unique monolithic MMSM technology. The technology is a package/device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is tightly controlled. The package parasitics of MPL4700 are optimized for PCS bands but devices can be used through X band.