MRLM140-05-H-RH

DC Input Voltage..................35V
Internal Power Dissipation
(Note 2)
Internally Limited
Maximum Junction Temperature..........150 C
Storage Temperature Range.... ..-65 C to +150 C
Lead Temperature
Soldering, (10 seconds) ...... ...... .300 C
Thermal Resistance
ThetaJA
(Still Air) ............ ...... ..232 C/W
(500 LF/Min Air Flow)............... 77 C/W
ThetaJC ......... .......... ..15 C/W
ESD Susceptibility
(Note 3).......... .......... ...2KV


Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specification might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics.

Note 2: The Maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TjMAX = 150 C), the junction-to-ambient thermal resistance (ThetaJA), and the ambient temperature (TA). PDMAX = (TjMAX - TA)/ThetaJA. If this dissipation is exceeded, the die temperature will rise above TjMAX and the electrical specifications do not apply. If the die temperature rises above 150 C, the device will go into the thermal shutdown.

Note 3: Human body model, 100pF discharged through 1.5K Ohms