MS2211 Selling Leads, Price trend, MS2211 DataSheet download, circuit diagram from SeekIC.com

Features: · REFRACTORY/GOLD METALLIZATION· EMITTER SITE BALLASTED· 5:1 VSWR CAPABILITY· LOW THERMAL RESISTANCE· INPUT/OUTPUT MATCHING· OVERLAY GEOMETRY· METAL/CERAMIC HERMETIC PACKAGE· POUT = 6.0 W MIN. WITH 9.3 dB GainPinoutSpecifications Symbol Parameter Value Unit PDISS Power Dissip...

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SeekIC No. : 004427268 Detail

MS2211: Features: · REFRACTORY/GOLD METALLIZATION· EMITTER SITE BALLASTED· 5:1 VSWR CAPABILITY· LOW THERMAL RESISTANCE· INPUT/OUTPUT MATCHING· OVERLAY GEOMETRY· METAL/CERAMIC HERMETIC PACKAGE· POUT = 6.0 W ...

MS2211 Data Sheet

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Part Number:: MS2211
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Upload time: 2026/1/28

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Recent History
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Product Details

Description

Features:

· REFRACTORY/GOLD METALLIZATION
· EMITTER SITE BALLASTED
· 5:1 VSWR CAPABILITY
· LOW THERMAL RESISTANCE
· INPUT/OUTPUT MATCHING
· OVERLAY GEOMETRY
· METAL/CERAMIC HERMETIC PACKAGE
· P_OUT = 6.0 W MIN. WITH 9.3 dB Gain

Pinout

Connection Diagram

Specifications

Symbol	Parameter	Value	Unit
P_DISS	Power Dissipation * (T_C 75)	25	W
I_C	Device Current *	0.9	A
V_CC	Collector - Supply Voltage *	32	V
T_J	Junction Temperature (Pulsed RF Operation)	250
T_STG	Storage Temperature	- 65 to + 200

Description

The MS2211 is designed for specialized avionics applications,including JTIDS, where power is provided under pulse formats utilizing short pulse widths and high burst or overall duty cycles.

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MS2211

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