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MFG:.  Package Cooled:.  D/C:07+  

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Part Number: MSL-174Y

 

MFG: .

Package Cooled: .

D/C: 07+

Description: The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suit...


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MSL-174Y General Description


The MSL-174Y, a YELLOW  source Chip  LED device, is designed in an indnstry standard   package suitable for SMT assembly method. It  utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

MSL-174Y Maximum Ratings

Parameter
Symbol
Maximum Rating
Unit
Peak Forward Current(1/10 Duty Cycle@1KHz )
IFP
80
mA
DC Forward Current
IF
25
mA
Power Dissipation
PD
68
mW
Reverse Voltage
VR
5
V
Operating Temperature Range
TOPR
-20 to +80
Storage Temperature Range
TSTG
-30 to +100

MSL-174Y Features

· Push-Button Backlighting
· LCD Backlighting
· Symbol Backlighting
· Front Panel Indicator

MSL-174Y Typical Application

· Small Size
· Industry Standard Footprint(0805)
· Compatible with IR Solder process
· Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels

MSL-174Y datasheet

MSL-174Y
PDF/DataSheet Download

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Related Part Number

MSL-174Y Relative Products

  • MSL-174UYL

    MSL-174UYL

    The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174UR

    MSL-174UR

    The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.

  • MSL-174UOL

    MSL-174UOL

    The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174UG

    MSL-174UG

    The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174TG

    MSL-174TG

    The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

  • MSL-174SO

    MSL-174SO

    The MSL-174SO, a ORANGE source Chip ED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes GaAsP on GaP LED chip echnology and water clear epoxy package.

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