MFG:. Package Cooled:. D/C:07+
MFG: .
Package Cooled: .
D/C: 07+
Description: The MSL-194DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly meth...
|
Parameter |
Symbol |
Maximum Rating |
Unit |
| Peak Forward Current(1/10 Duty Cycle@1KHz ) |
IFP |
200 |
mA |
| DC Forward Current |
IF |
25 |
mA |
| Power Dissipation |
PD |
55 |
mW |
| Reverse Voltage |
VR |
5 |
V |
| Operating Temperature Range |
TOPR |
-20 C to +80 C | |
| Storage Temperature Range |
TSTG |
-30 C to +100 C | |
MSL-194DR
PDF/DataSheet Download
The MSL-194BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package.
The MSL-194B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.
The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
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