MFG:. Package Cooled:. D/C:07+
MFG: .
Package Cooled: .
D/C: 07+
Description: The MSL-194UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT asse...
|
Parameter |
Symbol |
Maximum Rating |
Unit |
| Peak Forward Current(1/10 Duty Cycle@1KHz ) |
IFP |
100 |
mA |
| DC Forward Current |
IF |
25 |
mA |
| Power Dissipation |
PD |
68 |
mW |
| Reverse Voltage |
VR |
5 |
V |
| Operating Temperature Range |
TOPR |
-20 to +80 | |
| Storage Temperature Range |
TSTG |
-30 to +100 | |
MSL-194UG
PDF/DataSheet Download
The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
The MSL-194SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
The MSL-194HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
The MSL-194HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
The MSL-194G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
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