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MFG:.  Package Cooled:.  D/C:07+  

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Part Number: MSL-194UYL

 

MFG: .

Package Cooled: .

D/C: 07+

Description: The MSL-194UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly met...


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MSL-194UYL General Description


The MSL-194UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

MSL-194UYL Maximum Ratings

Parameter
Symbol
Maximum Rating
Unit
Peak Forward Current(1/10 Duty Cycle@1KHz )
IFP
100
mA
DC Forward Current
IF
25
mA
Power Dissipation
PD
65
mW
Reverse Voltage
VR
5
V
Operating Temperature Range
TOPR
-20 to +80
Storage Temperature Range
TSTG
-30 to +100

MSL-194UYL Features

· Push-Button Backlighting
· LCD Backlighting
· Symbol Backlighting
· Front Panel Indicator

MSL-194UYL Typical Application

· Small Size
· Industry Standard Footprint(1206)
· Compatible with IR Solder process
· Availalble in 8 mm Tape on 7"(178mm) Diameteer Reels

MSL-194UYL datasheet

MSL-194UYL
PDF/DataSheet Download

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Related Part Number

MSL-194UYL Relative Products

  • MSL-194UR

    MSL-194UR

    The MSL-194UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.

  • MSL-194UOL

    MSL-194UOL

    The MSL-194UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-194UG

    MSL-194UG

    The MSL-194UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-194TG

    MSL-194TG

    The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSL-194SO

    MSL-194SO

    The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

  • MSL-194SG

    MSL-194SG

    The MSL-194SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

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