MFG:. Package Cooled:. D/C:07+
MFG: .
Package Cooled: .
D/C: 07+
Description: The MSL-194Y, a YELLOW source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly meth...
|
Parameter |
Symbol |
Maximum Rating |
Unit |
| Peak Forward Current(1/10 Duty Cycle@1KHz ) |
IFP |
80 |
mA |
| DC Forward Current |
IF |
25 |
mA |
| Power Dissipation |
PD |
68 |
mW |
| Reverse Voltage |
VR |
5 |
V |
| Operating Temperature Range |
TOPR |
-20 to +80 | |
| Storage Temperature Range |
TSTG |
-30 to +100 | |
MSL-194Y
PDF/DataSheet Download
The MSL-194UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
The MSL-194UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.
The MSL-194UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
The MSL-194UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
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