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MSL-824HG-G

Features: · High performance · Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol Maximum Rating Unit Power Dissipation Pad 100 mW Continuous Forward Current ...

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SeekIC No. : 004428643 Detail

MSL-824HG-G: Features: · High performance · Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol ...

MSL-824HG-G Data Sheet

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Part Number:
MSL-824HG-G
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2026/1/26

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Product Details

Description



Features:

· High performance
· Excellent chip to chip consistency
· High reliability


Application

· LCD backlighting
· Symbol backlighting
· Front panel indicator


Specifications

Parameter
Symbol
Maximum Rating
Unit
Power Dissipation
Pad
100
mW
Continuous Forward Current
Iaf
30
mA
Reverse Current(VR=5V)
IR
10
vA
Operating Temperature Range
Topr
-40 to +85
Storage Temperature Range
Tstg
-40 to +85
Lead Soldering Temperature 260 for 5 second (2.0mm From Body)



Description

The MSL-824HG-G is designed based on in an industry standard package for ease of handing and use.
The package is water clear  epoxy within white plastic.


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