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Part Number: MTD20P06HDL

 

MFG: N/A

Package Cooled: NA/

D/C: 09+

Description: This advanced highcell density HDTMOS EFET is designed to withstand high energy in the avalanche and c...


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MTD20P06HDL General Description


This advanced highcell density HDTMOS EFET is designed to withstand high energy in the avalanche and commutation modes.The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for lowvoltage,highspeed switching applications in power supplies, converters and PWM motor controls, and other inductive loads. The avalanche energy capability is specified to eliminate the guesswork in designs where inductive loads are switched, and to offer additional safety margin against unexpected voltage transients.
• Ultra Low RDS(on), HighCell Density, HDTMOS
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature
• Avalanche Energy Specified
• Surface Mount Package Available in 16 mm, 13inch/2500 Unit, Tape & Reel, Add T4 Suffix to Part Number

MTD20P06HDL Maximum Ratings

Rating
Symbol
Value
Unit
DrainSource Voltage
VGSS
60
Vdc
DrainGate Voltage (RGS = 1.0 M)
VDGR
60
Vdc
GateSource Voltage
- Continuous
- NonRepetitive (tp10ms)

VGS
VGSM

±15
±20


Vdc
Vpk

Drain - Continuous
- Continuous @ 100°C
- Single Pulse (tp10 s)
ID
ID
IDM
15
9.0
45

Adc

Apk

Total Power Dissipation
Derate above 25°C
Total Power Dissipation @ TA = 25°C, when mounted to minimum recommended pad size
PD
72
0.58
1.75
Watts
W/°C
Watts
Operating and Storage Temperature Range
TJ,Tstg
55 to 150
°C
Single DraintoSource Avalanche
Energy - Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc, IL = 15 Apk, L = 2.7 mH, RG = 25)
EAS
300
mJ
Thermal Resistance - Junction to Case
- Junction to Ambient
- Junction to Ambient,when mounted with the minimum recommended pad size
RJC
RJA
RJA
1.73
100
71.4
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8, from case for 10 seconds
TL
260
°C

MTD20P06HDL datasheet

MTD20P06HDL
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