MOSFET DISC BY MFG 2/02
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| Transistor Polarity : | P-Channel | Drain-Source Breakdown Voltage : | - 60 V | ||
| Gate-Source Breakdown Voltage : | +/- 20 V | Continuous Drain Current : | 12 A | ||
| Resistance Drain-Source RDS (on) : | 0.23 Ohms | Configuration : | Single | ||
| Maximum Operating Temperature : | + 175 C | Mounting Style : | SMD/SMT | ||
| Package / Case : | TO-252 | Packaging : | Reel |
| Rating |
Symbol |
Value |
Unit |
| DraintoSource Voltage |
VDSS |
60 |
Vdc |
| DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
60 |
Vdc |
| GatetoSource Voltage - Continuous GatetoSource Voltage - Nonrepetitive (tp 10 ms) |
VGS VGSM |
± 15 ± 25 |
Vdc Vpk |
| Drain Current - Continuous - Continuous @ 100°C - Single Pulse (tp 10 s) |
ID ID IDM |
12 8.0 42 |
Adc Apk |
| Total Power Dissipation Derate above 25°C Total Power Dissipation @ 25°C(1) |
PD |
60 0.4 2.1 |
Watts W/°C Watts |
| Operating and Storage Temperature Range |
TJ, Tstg |
55 to 175 |
°C |
| Single Pulse DraintoSource Avalanche Energy - STARTING TJ = 25°C (VDD = 25 Vdc, VGS = 10Vdc, PEAK IL =12Apk, L = 3.0mH, RG = 25) |
EAS |
216 |
mJ |
| Thermal Resistance - Junction to Case - Junction to Ambient - Junction to Ambient(1) |
RJC RJA RJA |
2.5 100 71.4 |
°C/W |
| Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds |
TL |
260 |
°C |