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- Table of contents:
Molded
-
Suppliers
DataSheet
General Description
Molded Features
• As low as 1 oz.(28.34 g) average insertion force per pin.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% antiwicking of solder.
• Tapered entry for ease of insertion.
• To fit .100" (2.54 mm) grid.
• Easily customized to fit your application.
• Multiple finger contacts for reliability.
• Over 500 PGA footprints available.
• Closed bottom terminal for 100% antiwicking of solder.
• Tapered entry for ease of insertion.
• To fit .100" (2.54 mm) grid.
• Easily customized to fit your application.
- Datasheet:
- File Size: KB
- Manufacturer:
- Click here to Download
- · EPCS4SI8
- 226669 KB
- · UTC2411
- 136508 KB
- ·(M5M410092B)
- Mitsubishi
- 3D-RAM
- 1268750 KB
- ·_FCQ30A06
- NIEC [Nihon Inter Electronics Corporation]
- LOW FORWARD VOLTAGE DROP
- 29515 KB
- ·0001.2501.PT
- Fuse
- 40400 KB
- ·0001.2501.TR
- Fuse
- 40400 KB
- ·0001.2502.PT
- Fuse
- 40400 KB
- ·0001.2502.TR
- Fuse
- 40400 KB
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