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NE681M23

Features: • NEW MINIATURE M23 PACKAGE: World's smallest transistor package footprint leads are completely underneath package body Low profile/0.55 mm package height Ceramic substrate for better RF performance• HIGH GAIN BANDWIDTH PRODUCT: fT = 7 GHz• LOW NOISE FIGURE: NF = 1.4 dB...

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NE681M23: Features: • NEW MINIATURE M23 PACKAGE: World's smallest transistor package footprint leads are completely underneath package body Low profile/0.55 mm package height Ceramic substrate for bette...

NE681M23 Data Sheet

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Part Number:
NE681M23
Supply Ability:
5000

Price Break

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/12/6

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Product Details

Description



Features:

• NEW MINIATURE M23 PACKAGE:
World's smallest transistor package footprint
leads are completely underneath package body
Low profile/0.55 mm package height
Ceramic substrate for better RF performance
• HIGH GAIN BANDWIDTH PRODUCT: fT = 7 GHz
• LOW NOISE FIGURE: NF = 1.4 dB


Specifications

SYMBOLS
PARAMETERS
UNITS
RATINGS
VCEO
Collector to Emitter Voltage
V

20

VCBO
Collector to Base Voltage
V
10
VEBO
Emitter to Base Voltage
V
1.5
IC
Collector Current
mA
65
PT
Total Power Dissipation
mW
TBD
Tj
Junction Temperature
°C
150
TSTG
Storage Temperature
°C
-65 to +125
Note:
1. Operation in excess of any one of these parameters may result in permanent damage.


Description

The NE681M23 transistor is ideal for low noise, high gain, and low cost amplifier applications. NEC's new low profile/ ceramic substrate style "M23" package of NE681M23 is ideal for today's portable wireless applications. The NE681 is also available in chip, Micro-x, and six different low cost plastic surface mount package styles.




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