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NT2955

Features: • Avalanche Energy Specified• IDSS and VDS(on) Specified at Elevated Temperature• Designed for Low−Voltage, High−Speed Switching Applications and to Withstand High Energy in the Avalanche and Commutation Modes• Pb−Free Packages are AvailableSpeci...

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NT2955: Features: • Avalanche Energy Specified• IDSS and VDS(on) Specified at Elevated Temperature• Designed for Low−Voltage, High−Speed Switching Applications and to Withstand...

NT2955 Data Sheet

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Part Number:
NT2955
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Avalanche Energy Specified
• IDSS and VDS(on) Specified at Elevated Temperature
• Designed for Low−Voltage, High−Speed Switching Applications and to Withstand High Energy in the Avalanche and Commutation Modes
• Pb−Free Packages are Available




Specifications

Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
-60
Vdc
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp 10 ms)
VGS
VGSM
± 20
± 25
Vdc
Vpk
Drain Current
Drain Current − Continuous @ Ta = 25°C
Drain Current − Single Pulse (tp 10 ms)
ID
IDM
−12
−36
Adc
Apk
Total Power Dissipation @ Ta = 25°C
PD
55
W
Operating and Storage Temperature Range
TJ,Tstg
−55 to 175
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, Peak
IL = 12 Apk, L = 3.0 mH, RG = 25 )
EAS
216
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
RJC
RJA
RJA
2.73
71.4
100
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8 in. from case for 10 seconds
TL
260
°C

Maximum ratings are those values beyond which device damage can occur.Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 1 in pad size (Cu area = 1.127 in2).
2. When surface mounted to an FR4 board using the minimum recommended pad size (Cu area = 0.412 in2).




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