MFG:ON Package Cooled:06+ D/C:800/REEL
MFG: ON
Package Cooled: 06+
D/C: 800/REEL
Description: Designed for low voltage, high speed switching applications in power supplies, converters, power motor...
Designed for low voltage, high speed switching applications in power supplies, converters, power motor controls and bridge circuits.
|
Rating |
Symbol |
Value |
Unit |
|
Drain−to−Source Voltage |
VDSS |
60 |
Vdc |
|
Drain−to−Gate Voltage (RGS = 10 M ) |
VDGR |
60 |
Vdc |
|
Gate−to−Source Voltage − Continuous − Non−Repetitive (tp10 ms) |
V GS V GS |
±15 ±20 |
Vdc |
|
Drain Current − Continuous @ TA = 25°C − Continuous @ TA 100°C − Single Pulse (tp10 s) |
I D I D I DM |
60 42.3 180 |
Adc Apk |
|
Total Power Dissipation @ TA = 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 1) |
PD |
150 1.0 2.4 |
W W/°C W |
|
Operating and Storage Temperature Range |
TJ, Tstg |
−55 to 175 |
°C |
|
Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 75 Vdc, VGS = 5.0 Vdc, L = 0.3 mH, I L(pk) = 55 A,VDS = 60 Vdc) |
EAS |
454 |
mJ |
|
Thermal Resistance, − Junction−to−Case − Junction−to−Ambient (Note 1) |
RJC RJA |
1.0 62.5 |
°C/W |
|
Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds |
TL |
260 |
°C |
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using the minimum recommended pad size, (Cu Area 0.412 in 2).
NTB60N06L
PDF/DataSheet Download
NTB60N06 Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits.
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