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MFG:ONS  Package Cooled:DPAK(TO-252)  D/C:09+  

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Part Number: NTD25P03LG

 

MFG: ONS

Package Cooled: DPAK(TO-252)

D/C: 09+

Description: Designed for low voltage, high speed switching applications and to withstand high energy in the avalan...


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NTD25P03LG General Description


Designed for low voltage, high speed switching applications and to withstand high energy in the avalanche and commutation modes. The source−to−drain diode recovery time is comparable to a discrete fast recovery diode.

NTD25P03LG Maximum Ratings

Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
-30
V
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tp10 ms)
VGS
VGS
±15
±20
V
Vdc
Drain Current
− Continuous @ TA = 25°C
− Single Pulse (tp10 s), TJ = 175°C
ID
ID
ID
IDM
−25
−75
A
Apk
Total Power Dissipation @ TA = 25°C
PD
75
Watts
Operating and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc,
Peak IL = 20 Apk, L = 1.0 mH,
RG = 25)
EAS
200
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
RJC
RJA
RJA
1.65
67
120
°C/W
Maximum Lead Temperature for Soldering Purposes,
1/8 from case for 10 seconds
TL
260
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended pad size.

NTD25P03LG Typical Application

• PWM Motor Controls
• Power Supplies
• Converters
• Bridge Circuits
• Pb−Free Package is Available

NTD25P03LG Connection Diagram

NTD25P03LG Connection Diagram

NTD25P03LG datasheet

NTD25P03LG
PDF/DataSheet Download

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