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NTLJD3119C

Features: • Complementary N−Channel and P−Channel MOSFET• WDFN Package with Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package• Leading Edge Trench Technology for Low On Resistance• 1.8 V Gate Threshold Voltage•...

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SeekIC No. : 004436676 Detail

NTLJD3119C: Features: • Complementary N−Channel and P−Channel MOSFET• WDFN Package with Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package...

NTLJD3119C Data Sheet

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Part Number:
NTLJD3119C
Supply Ability:
5000

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  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Complementary N−Channel and P−Channel MOSFET
• WDFN Package with Exposed Drain Pad for Excellent Thermal Conduction
• Footprint Same as SC−88 Package
• Leading Edge Trench Technology for Low On Resistance
• 1.8 V Gate Threshold Voltage
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• This is a Pb−Free Device


Application

• Synchronous DC−DC Conversion Circuits
• Load/Power Management of Portable Devices like PDA's, Cellular Phones and Hard Drives
• Color Display and Camera Flash Regulators


Specifications

Parameter Symbol Value Unit
Drain−to−Source Voltage N−Ch VDSS 20 V
P−Ch -20
Gate−to−Source Voltage N−Ch VGS ±8.0 V
P−Ch
N−Channel
Continuous Drain
Current (Note 1)		 Steady
State		 TA = 25°C ID 3.8 A
TA = 85°C 2.8
t 5 s TA = 25°C 4.6
P−Channel
Continuous Drain
Current (Note 1)		 Steady
State		 TA = 25°C ID -3.3 A
TA = 85°C -2.4
t 5 s TA = 25°C -4.1
Power Dissipation
(Note 1)		 Steady
State		 TA = 25°C PD 1.5 W
t 5 s 2.3
N−Channel
Continuous Drain
Current (Note 2)		 Steady
State		 TA = 25°C ID 2.6 A
  1.9
P−Channel
Continuous Drain
Current (Note 2)		 Steady
State		 TA = 25°C ID -2.3 A
  -1.6
Power Dissipation
(Note 2)		 Steady
State		 TA = 25°C PD 0.71 W
Pulsed Drain Current N−Ch tp = 10s IDM 18 A
P−Ch -20
Operating Junction and Storage Temperature TJ, TSTG −55 to
150
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)		     TL 260

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm2, 2 oz Cu.




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