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NTLJF3118N

Features: • WDFN 2x2 mm Package Provides Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package• 1.8 V VGS Rated RDS(on)• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments• Low VF 2 A Schottky Diode• This is a Pbͨ...

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SeekIC No. : 004436678 Detail

NTLJF3118N: Features: • WDFN 2x2 mm Package Provides Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package• 1.8 V VGS Rated RDS(on)• Low Profile (<...

NTLJF3118N Data Sheet

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Part Number:
NTLJF3118N
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/4/28

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Product Details

Description



Features:

• WDFN 2x2 mm Package Provides Exposed Drain Pad for Excellent Thermal Conduction
• Footprint Same as SC−88 Package
• 1.8 V VGS Rated RDS(on)
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• Low VF 2 A Schottky Diode
• This is a Pb−Free Device




Application

• DC−DC Boost/Buck Converter
• Low Voltage Hard Disk DC Power Source


Pinout

Connection Diagram


Specifications

Parameter Symbol Value Unit
Drain−to−Source Voltage VDSS 20 V
Gate−to−Source Voltage VGS ±12 V
Continuous Drain Current
(Note 1)		 Steady
State		 TA = 25°C ID 3.8 A
TA = 85°C 2.8
t 5 s TA = 25°C 4.6
Power Dissipation
(Note 1)		 Steady
State		 TA = 25°C PD 1.5 W
t 5 s 2.2
Continuous Drain Current
(Note 2)		 Steady
State		 TA = 25°C ID 2.6 A
TA = 85°C 1.9
Power Dissipation
(Note 2)		 TA = 25°C PD 0.7
Pulsed Drain Current tp = 10 s IDM 18 A
Operating Junction and Storage Temperature TJ,
TSTG		 −55 to 150 °C
Source Current (Body Diode) IS 1.8 A
Lead Temperature for Soldering Purposes
(1/8 from case for 10 s)		 TL 260 °C


Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 2 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size.




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