Features: · Mini-flat package· Half pitch type (lead pitch : 1.27mm)· Isolation voltage (Viso : 2 500Vrms)· Applicable to infrared ray reflow (230°C, for MAX. 30s)· High reliability· Taping package PC3H7 (1ch) PC3Q67Q (4ch)· Recognized by UL, file No. E64380 Approved by VDE, No.5922UGApplication·P...
PC3Q67Q: Features: · Mini-flat package· Half pitch type (lead pitch : 1.27mm)· Isolation voltage (Viso : 2 500Vrms)· Applicable to infrared ray reflow (230°C, for MAX. 30s)· High reliability· Taping package ...
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| Parameter | Symbol | Rating | Unit | ||
| Input | Forward current | IF | 50 | mA | |
| *1Peak forward current | IFM | 1 | mA | ||
| Reverse voltage | VR | 6 | V | ||
| Power dissipation | P | 70 | mW | ||
| Output | Collector-emitter voltage | PC3H7 | VCEO | 70 | V |
| PC3Q67Q | VCEO | 35 | |||
| Emitter-collector voltage | VECO |
6 | V | ||
| Collector current | IC | 50 | |||
| Collector power dissipation | PC | 150 | mW | ||
| Total power dissipation | Ptot | 170 | mW | ||
| *2Isolation voltage | Viso | 2.5 | KVrms | ||
| Operating temperature | Topr | -30 to +100 | |||
| Storage temperature | Tstg | -40 to +125 | |||
| *3Soldering temperature | Tsol | 260 | |||