PCN DSG-COM/03/145

      The PCN DSG-COM/03/145 type of the change is a Package assembly process change for the reason of environment directive. For changing lead from plating in the way of using preplating nickel palladium gold leadframe NiPdAu. ELECTRICAL & MECHANICAL parameters won't be affected by the change. Samples LM393DT/LM358DT and Other samples such as on request are available.  YOUR SAMPLE ORDER CAN BE BOOKED IN NON-STANDARD AS THE FOLLOWING COMMENT "AS PER LEADFREE PCN DSG-COM/03/145".
      The forecasyed date of change of PCN DSG-COM/03/145PCN DSG-COM/03/145 is 07-May-2003, The frecasted date of samples for customer is 07-Feb-2003 and the forecasted date for STMicroelectronics change qualification report availability is 07-Feb-2003.
      There are some changes of PCN DSG-COM/03/145 between the new process and current. The assembly flow + Control Plan of new one is 7124337 while the current one is 7071671. Frame (material) of new one is Copper + NiPdAu preplating while the current one is Copper, Die attach material of new one is CMP8000 CH4 then the current one is MP8000 CH4 and the lead finishing of new one is NiPdAu(preplated) then the current one is Tin plating (SnPb85/15).There are no diffrence in the aspects of the assembly site(ST Muar (Malaysia)), Wire material (Gold),Wire diameter (I MIL), mold compound (MP8000 CH4) and Wire bond method (Thermosonic).