Application
MULTI-MIX PICO™ Z-SERIES POWER DIVIDERS
The Multi-Mix® PDD-Z series provides an in-phase, binary power divider with low insertion loss in a small outline. Accurate phase and amplitude balance make them ideal for applications involving IQ networks, power amplifiers, signal distribution and processing.
PDD-Z power dividers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.
The PDD-Z series is an easy to install SMD designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.
Additional benefits include:
Available on tape and reel
Cost effective for commercial wireless applications
Small outline size
Operating temperature range 55 to +85.
Can be integrated with other Multi-Mix® components in a multi-function module
RELIABILITY
The product family has passed environmental screening including Thermal shock, Burn-in, Acceleration, Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (>1000 cycles).
THE MULTI-MIX® PROCESS
Multi-Mix® is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure with superior performance at microwave and millimeter wave frequencies. The bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and platedthrough vias to form a SMD module that requires no additional packaging and is suitable for automated assembly.
Description`MULTI-MIX PICO™ Z-SERIES POWER DIVIDERS
The PDD-3Z provides an in-phase, binary power divider with low insertion loss in a small outline. Accurate phase and amplitude balance make them ideal for applications involving IQ networks, power amplifiers, signal distribution and processing.
PDD-3Z power dividers are fusion bonded multilayer stripline assemblies. The fusion bonding process yields a homogeneous monolithic dielectric structure with reliability, ruggedness, and electrical performance that is superior to conventional adhesive bonding techniques.
The PDD-3Z series is an easy to install SMD designed specifically for the full spectrum of wireless applications. The high stability ceramic filled PTFE dielectrics utilized in these components are compatible with common substrates such as FR-4, G-10, and polyamide. The wrap around ground plane provides excellent EM shielding.
Additional benefits of PDD-3Z include:
Available on tape and reel
Cost effective for commercial wireless applications
Small outline size
Operating temperature range 55 to +85.
Can be integrated with other Multi-Mix® components in a multi-function module
`RELIABILITY
The PDD-3Z has passed environmental screening including Thermal shock, Burn-in, Acceleration,Vibration, Mechanical Shock, Moisture Resistance, Resistance to Solder Heat, and Thermal Cycling Life Test (>1000 cycles).
`THE MULTI-MIX® PROCESS
PDD-3Z is a manufacturing process based on fluoropolymer composite substrates that are fusion bonded together into a multilayer structure. The fusion bonding process yields a homogeneous monolithic structure with superior performance at microwave and millimeter wave frequencies. The bonded layers can contain embedded semiconductors, MMICs, etched resistors, circuit patterns, and platedthrough vias to form a SMD module that requires no additional packaging and is suitable for automated assembly.
PDD-3Z Data Sheet
