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| Parameter | Symbol | Limit Values | Unit | |
| min | max | |||
| Ambient temperature under bias | Ta | -40 | 85 | °C |
| Junction temperature under bias | Tj | 125 | °C | |
| Storage temperature | Tstg | -65 | 125 | °C |
| Voltage on any pin with respect to ground | vs | -0.4 | VDD3+0.4 | V |
Note: Stresses above those listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Typical applications for the TE3-MUX support of channelized DS3 with serial line interfaces on the low speed side. The system partitioning due to ORB compliance may allow usage in following systems:
• Terminal Multiplexers with DS1/E1 and HDSL interfaces
• Add Drop Multiplexers (ADM) with DS1/E1 and HDSL interfaces
• Digital Cross Connect devices with DS1/E1 and HDSL interfaces
• DLC COT and RT
• Channelized DS3 applications
The TE3-MUX supports 32 low speed serial interfaces. These interfaces can be mapped to any of the 28 DS3 tributaries which provides for 4:28 protection.
PEB3445E
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