PFM21030F

This versatile UMTS module PFM21030F provides excellent linearity and efficiency in a low-cost surface mount package. The PFM21030 includes two stages of amplification, along with internal sense FETs that are on the same silicon die as the RF devices. These thermally coupled sense FETs simplify the task of bias temperature compensation of the overall amplifier. The PFM21030F includes RF input, interstage, and output matching elements. The source and load impedances required for optimum operation of the module are much higher (and simpler to realize) than for unmatched Si LDMOS transistors of similar performance.

The surface mount package base of PFM21030F is typically soldered to a conventional PCB pad with an array of via holes for grounding and thermal sinking of the PFM21030F. Optimized internal construction supports low FET channel temperature for reliable operation.