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PS21563

Features: · Compact Packages· Single Power Supply· Integrated HVICs· Direct Connection to CPUApplication· Washing Machines· Refrigerators·Air Conditioners·Small Servo Motors·Small Motor ControlSpecifications Characteristics Symbol PS21563 Units Power Device Junction Temperature*...

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SeekIC No. : 004465457 Detail

PS21563: Features: · Compact Packages· Single Power Supply· Integrated HVICs· Direct Connection to CPUApplication· Washing Machines· Refrigerators·Air Conditioners·Small Servo Motors·Small Motor ControlSpeci...

PS21563 Data Sheet

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Part Number:
PS21563
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

· Compact Packages
· Single Power Supply
· Integrated HVICs
· Direct Connection to CPU


Application

· Washing Machines
· Refrigerators
·Air Conditioners
·Small Servo Motors
·Small Motor Control


Specifications

Characteristics
Symbol
PS21563
Units
Power Device Junction Temperature*
Tj
-20 to 125
Module Case Operation Temperature (See Tf Measurement Point Illustration)
Tf
-20 to 100
Storage Temperature
Tstg
-40 to 125
Mounting Torque, M3 Mounting Screws
-
8.5
in-lb
Module Weight (Typical)
-
20
Grams
Self-protection Supply Voltage Limit (Short Circuit Protection Capability)**
VCC(prot.)
400
Volts
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal, Connection Pins to Heatsink Plate
VISO
2500
Volts
*The maximum junction temperature rating of the power chips integrated within the DIP-IPM is 150  (@Tf  
  100  C).  However, to ensure safe operation of the DIP-IPM,the average junction temperature should be
  limited to Tj(avg) 125 (@Tf 100 ).
**VD = 13.5 ~ 16.5V, Inverter Part, Tj = 125 , Non-repetitive, Less than 2µs


Description

DIP and Mini DIP-IPMs are intelligent power modules PS21563 that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 5th generation IGBTs, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design
time.




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