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R1LA1616R

Features: • Single 1.65-2.3V power supply• Small stand-by current:3A (1.8V, typ.)• Smaller stand-by current by Data retention mode ( CS2 ='L') : 1A (1.8V, typ.)• Data retention supply voltage =1.5V• No clocks, No refresh• Easy memory expansion by CS1#, CS2, LB#...

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SeekIC No. : 004468947 Detail

R1LA1616R: Features: • Single 1.65-2.3V power supply• Small stand-by current:3A (1.8V, typ.)• Smaller stand-by current by Data retention mode ( CS2 ='L') : 1A (1.8V, typ.)• Data retent...

R1LA1616R Data Sheet

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Part Number:
R1LA1616R
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Single 1.65-2.3V power supply
• Small stand-by current:3A (1.8V, typ.)
• Smaller stand-by current by "Data retention mode"("CS2"='L') : 1A (1.8V, typ.)
• Data retention supply voltage =1.5V
• No clocks, No refresh
• Easy memory expansion by CS1#, CS2, LB# and UB#
• Common Data I/O
• Three-state outputs: OR-tie capability
• OE# prevents data contention on the I/O bus
• Process technology: 0.15um CMOS


Specifications

Parameter
Symbol
Value
Unit
Supply voltage relative to VSS
VCC
−0.5 to +2.7
V
Voltage on any pin relative to VSS
VT
−0.5*1 to VCC + 0.3*2
V
Power dissipation
PT
0.47
W
Operating temperature
Topr
45 to +85
°C
Storage temperature
Tstg
−65 to +150
°C
Storage temperature under bias
Tbias
45 to +85
°C

Note 1: -1.0V in case of AC (Pulse width £ 30ns)
         2:Maximum voltage is +2.7V



Description

The R1LA1616R Series is a family of low voltage 16-Mbit static RAMs organized as 1048576-words by 16-bit, fabricated by Renesas's high-performance 0.15um CMOS and TFT technologies.

The R1LA1616R Series is suitable for memory applications where a simple interfacing , battery operating and battery backup are the important design objectives.

The R1LA1616R Series is packaged in a 52pin micro thin small outline mount device[ TSOP / 10.79mm x 10.49mm with the pin-pitch of 0.4mm] or a 48balls fine pitch ball grid array [f-BGA / 7.5mmx8.5mm with the ball-pitch of 0.75mm and 6x8 array] . It gives the best solution for a compaction of mounting area as well as flexibility of wiring pattern of printed circuit boards.




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