R1LV1616R

Features: • Single 2.7-3.6V power supply• Small stand-by current:2µA (3.0V, typ.)• Data retention supply voltage =2.0V• No clocks, No refresh• All inputs and outputs are TTL compatible• Easy memory expansion by CS1#, CS2, LB# and UB#• Common Data I/O...

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SeekIC No. : 004468953 Detail

R1LV1616R: Features: • Single 2.7-3.6V power supply• Small stand-by current:2µA (3.0V, typ.)• Data retention supply voltage =2.0V• No clocks, No refresh• All inputs and outp...

floor Price/Ceiling Price

Part Number:
R1LV1616R
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/5/17

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Product Details

Description



Features:

• Single 2.7-3.6V power supply
• Small stand-by current:2µA (3.0V, typ.)
• Data retention supply voltage =2.0V
• No clocks, No refresh
• All inputs and outputs are TTL compatible
• Easy memory expansion by CS1#, CS2, LB# and UB#
• Common Data I/O
• Three-state outputs: OR-tie capability
• OE# prevents data contention on the I/O bus
• Process technology: 0.15um CMOS



Pinout

  Connection Diagram


Specifications

Parameter Symbol Value Unit
Power supply voltage relative to Vss Vcc -0.5 to +4.6 V
Terminal voltage on any pin relation toVss PT -0.5*1 to Vcc+0.3*2 V
Power dissipation VT 0.7 W
Operation temperature Topr R ver. 0 to +70 °C
W ver. -20 to +85
I ver. -40 to +85
Storage temperature Tstg -65 to +150 °C
Storage temperature range under bias Tbias R ver. 0 to +70 °C
W ver. -20 to +85
I ver. -40 to +85
Note 1. -2.0V in case of AC (Pulse width 30ns)
         2. Maximum voltage is +4.6V



Description

The R1LV1616R Series is a family of low voltage 16-Mbit static RAMs organized as 1048576-words by 16-bit, fabricated by Renesas's high-performance 0.15um CMOS and TFT technologies.

The R1LV1616R Series is suitable for memory applications where a simple interfacing , battery operating and battery backup are the important design objectives.

The R1LV1616R Series is packaged in a 52pin micro thin small outline mount device[µTSOP / 10.79mm x 10.49mm with the pin-pitch of 0.4mm] or a 48balls fine pitch ball grid array [f-BGA / 7.5mmx8.5mm with the ball-pitch of 0.75mm and 6x8 array] . It gives the best solution for a compaction of mounting area as well as flexibility of wiring pattern of printed circuit boards.




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